| 型号 | 制造商 | 描述 | 操作 |
| SIGC158T120R3EX1SA4 [更多] | Infineon Technologies AG | Trans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T120R3EX1SA4) RoHS: Compliant | 搜索 |
| SIGC158T120R3EX1SA4 [更多] | Infineon Technologies AG | Trans IGBT Chip N-CH 1.2KV DIE (Alt: SIGC158T120R3EX1SA4) RoHS: Compliant | 搜索 |