| 型号 | 制造商 | 描述 | 操作 |
| C1S 3.5 [更多] | Belden Inc | Surface Mount Fuses 1206 SMT Fuse Slow Blow, 3.5A RoHS: Compliant | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| C1S 3.5 [更多] | Bel Fuse | Fuse Chip 3.5A 63V Slow Blow 2-Pin Solder Pad Surface Mount - Tape and Reel (Alt: C1S 3.5) RoHS: Compliant Min Qty: 5000 Container: Reel | 搜索 |
| C1S 3.5 [更多] | Bel Fuse | Fuse Chip 3.5A 63V Slow Blow 2-Pin Solder Pad Surface Mount - Tape and Reel (Alt: C1S 3.5) RoHS: Compliant Min Qty: 5000 Container: Reel | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| C1S 3.5 [更多] | Bel Fuse | Fuse Chip Slow Blow Acting 3.5A 63V SMD Solder Pad 1206 Ceramic CE/cULus RoHS: Compliant | 搜索 |
| C1S 3.5 [更多] | Bel Fuse | Fuse Chip Slow Blow Acting 3.5A 63V SMD Solder Pad 1206 Ceramic CE/cULus RoHS: Compliant | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| TDA18212HN/M/C1/S3518 [更多] | NXP Semiconductors | 搜索 | |
| TDA18212HN/S/C1/S3518 [更多] | NXP Semiconductors | 搜索 | |
| TDA18273HN/C1/S3518 [更多] | NXP Semiconductors | 搜索 |