| 型号 | 制造商 | 描述 | 操作 |
| TDGL003 [更多] | Microchip Technology Inc | Development Boards & Kits - PIC / DSPIC chipKIT Max32 Development Board | 搜索 |
| 1546011-2 [更多] | TE Connectivity Ltd | Barrier Terminal Blocks 3PCV-04008=3PCV-ASSY | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| 1546011-2 [更多] | TE Connectivity Ltd | Conn Barrier Strip 4 POS 6.35mm Solder ST Thru-Hole (Alt: 1546011-2) | 搜索 |
| 1546011-2 [更多] | TE Connectivity Ltd | Conn Barrier Strip 4 POS 6.35mm Solder ST Thru-Hole - Bulk (Alt: 1546011-2) | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| 1546011-2 [更多] | TE Connectivity Ltd | 3PCV-04-008=3PCV-ASSY | 搜索 |
| 1546011-2 [更多] | TE Connectivity Ltd | 3PCV-04-008=3PCV-ASSY | 搜索 |
| 1546011-2 [更多] | TE Connectivity Ltd | 3PCV-04-008=3PCV-ASSY | 搜索 |