| 型号 | 制造商 | 描述 | 操作 |
| ZSC31050FAB [更多] | Integrated Device Technology Inc | Advanced Differential Sensor Signal Conditioner -40 to 125°C Die Unsawn on Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSC31050FAB) RoHS: Compliant Min Qty: 2900 Container: Waffle Pack | 搜索 |