| 型号 | 制造商 | 描述 | 操作 |
| 410-003-05 [更多] | Glenair Inc | Circular MIL Spec Backshells TAG RING SHIELD TERM 8 SLOTS | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| 410-003-05 [更多] | Glenair Inc | ADAPTER - Bulk (Alt: 410-003-05) RoHS: Not Compliant | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| MLK1005S39NJ [更多] | TDK Corporation of America | Ind High Frequency Multi-Layer 39nH 5% 100MHz 6Q-Factor 200mA 0402 RoHS: Compliant | 搜索 |
| MLK1005S2N7S [更多] | TDK Corporation of America | Ind High Frequency Multi-Layer 2.7nH 0.3nH 100MHz 6Q-Factor 500mA 0402 RoHS: Compliant | 搜索 |
| MLK1005S68NJ [更多] | TDK Corporation of America | Inductor RF Chip Unshielded Multi-Layer 68nH 5% 100MHz 6Q-Factor Ceramic 150mA 1.5Ohm DCR 0402 RoHS: Compliant | 搜索 |
| MLK1005S8N2D [更多] | TDK Corporation of America | Inductor RF Chip Unshielded Multi-Layer 8.2nH 0.5nH 100MHz 7Q-Factor Ceramic 350mA 380mOhm DCR 0402 RoHS: Compliant | 搜索 |
| MLK1005S5N6D [更多] | TDK Corporation of America | Inductor RF Chip Unshielded Multi-Layer 5.6nH 0.5nH 100MHz 7Q-Factor Ceramic 400mA 300mOhm DCR 0402 RoHS: Compliant | 搜索 |
| MLG1608B2N2S [更多] | TDK Corporation of America | Ind High Frequency Multi-Layer 2.2nH 0.3nH 100MHz 10Q-Factor 600mA 0603 RoHS: Compliant | 搜索 |
| MLG1608B4N7S [更多] | TDK Corporation of America | Inductor High Frequency Chip Unshielded Multi-Layer 4.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 150mOhm DCR 0603 RoHS: Compliant | 搜索 |
| MLG1608B10NJ [更多] | TDK Corporation of America | Inductor High Frequency Chip Unshielded Multi-Layer 10nH 5% 100MHz 12Q-Factor Ceramic 600mA 200mOhm DCR 0603 RoHS: Compliant | 搜索 |
| MLK1005S12NJ [更多] | TDK Corporation of America | Ind High Frequency Multi-Layer 12nH 5% 100MHz 7Q-Factor 350mA 0402 RoHS: Compliant | 搜索 |
| MLG1608B2N7S [更多] | TDK Corporation of America | Inductor High Frequency Chip Unshielded Multi-Layer 2.7nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 120mOhm DCR 0603 RoHS: Compliant | 搜索 |
| MLG1608B3N9S [更多] | TDK Corporation of America | Inductor High Frequency Chip Unshielded Multi-Layer 3.9nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 140mOhm DCR 0603 RoHS: Compliant | 搜索 |
| MLK1005S1N5S [更多] | TDK Corporation of America | Ind RF Chip Unshielded Multi-Layer 1.5nH 0.3nH 100MHz 6Q-Factor Ceramic 500mA 0402 RoHS: Compliant | 搜索 |
| MLG1608BR10J [更多] | TDK Corporation of America | Inductor High Frequency Chip Unshielded Multi-Layer 100nH 5% 100MHz 14Q-Factor Ceramic 300mA 1Ohm DCR 0603 RoHS: Compliant | 搜索 |
| MLK1005S3N9S [更多] | TDK Corporation of America | Inductor RF Chip Unshielded Multi-Layer 3.9nH 0.3nH 100MHz 7Q-Factor Ceramic 400mA 250mOhm DCR 0402 RoHS: Compliant | 搜索 |
| MLK1005S1N2S [更多] | TDK Corporation of America | Inductor RF Chip Unshielded Multi-Layer 1.2nH 0.3nH 100MHz 5Q-Factor Ceramic 500mA 120mOhm DCR 0402 RoHS: Compliant | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| 410-003-05 [更多] | Glenair Inc | Circular MIL Spec Backshells TAG RING SHIELD TERM 8 SLOTS | 搜索 |
